Mi­cro-Elec­tro­me­cha­ni­cal Sys­tems

The lecture Micro-Electromechanical Systems consists of a technology oriented and a sensor based part to describe the integration and operation of modern microsystems based on silicon. It includes basic processes like wet and dry etching, physical principles for sensor effects, and common setups for sensor systems and packages.

Processes
• Integration processes for 3D-microstructures
• Wafer bonding
• Lithography Galvanic 
• Bulk micro machining
• Surface micro mechanics 

Sensor Devices 
• Acceleration sensors
• Pressure sensor devices
• Rotation rate sensors
• Special sensors 

Actuators
• Principles of micro actuators
• Examples for integrated actuators
• Micro motors
• Ink jets
• Digital mirror arrays for image projection

Packaging
• Substrates and carriers 
• Wire bonding
• Tape automated bonding
• Flip chip
• Chip size packages

Fachkompetenz / Domain competence:

The students are able to describe the operational principle of microsystems and micro electromechanical systems. They are able to choose the right sensor for a given application.

Fachübergreifende Kompetenzen / Key qualifications:

The students

• learn to transfer the acquired skills also to other disciplines
• extend their cooperation and team capabilities as well as the presentation skills in the context of solving the exercises
• learn strategies to acquire knowledge from literature and internet

Projector presentation accompanied by board sketches and short films about the sensor function.

A basic knowledge of semiconductor technology is necessary.

Keine / None

Mündliche Prüfung / oral exam

Englisch / English

Skript in deutscher Sprache

Buch Mikrosystemtechnik vom Dozenten

• M. Köhler: Etching in Microsystem Technology, Wiley-VCH, 1999
• W. Elwenspoek, R. Wiegerink: Mechanical Microsensors, Springer, 2000
• T.-R. Hsu: MEMS Packaging, INSPEC, 2004

U. Hilleringmann: Mikrosystemtechnik, Teubner, 2006