Ver­öf­fent­lichte Artikel

Pub­lic­a­tions

2024

A low cost weather monitoring, PV and prediction system in East Africa

G.M. Kagarura, U. Hilleringmann, D. Petrov, in: 2023 IEEE International Conferences on Internet of Things (IThings) and IEEE Green Computing &Amp; Communications (GreenCom) and IEEE Cyber, Physical &Amp; Social Computing (CPSCom) and IEEE Smart Data (SmartData) and IEEE Congress on Cybermatics (Cybermatics), IEEE, 2024.

DOI

Smart Metering and Choice Architecture in Demand-Side Management: A Power Resource-Constrained Perspective

L.D. Namujju, I. Mwammenywa, G.M. Kagarura, U. Hilleringmann, B. Hehenkamp, in: 2024 IEEE 8th Energy Conference (ENERGYCON), IEEE, 2024.

DOI

Smart Metering and Choice Architecture in Demand-Side Management: A Power Resource-Constrained Perspective

L.D. Namujju, I. Mwammenywa, G.M. Kagarura, U. Hilleringmann, B. Hehenkamp, in: 2024 IEEE 8th Energy Conference (ENERGYCON), IEEE, 2024.

DOI

A Novel Autonomous and Real-time Load Monitoring and Control System in Microgrids based on Fuzzy Logic Control and LoRa Wireless Communication

I.A. Mwammenywa, A Novel Autonomous and Real-Time Load Monitoring and Control System in Microgrids Based on Fuzzy Logic Control and LoRa Wireless Communication, 2024.


A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method

S. Lange, M. Olbrich, D. Hemker, J. Maalouly, J. Kutter, D. Schröder, C. Hedayat, M. Kleinen, A. Grünwaldt, J. Bärenfänger, H. Mathis, H. Kuhn, in: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, IEEE, Bruges, Belgium, 2024.

DOI

Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications

J. Maalouly, D. Hemker, S. Lange, M. Olbrich, C. Hedayat, J. Kutter, H. Mathis, in: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, IEEE, Brugge, Belgium , 2024.

DOI

Enhancing Information Extraction in EMC Measurements through Artificial Intelligence

M. Stiemer, S. Lange, D. Schröder, C. Hedayat, J. Maalouly, D. Hemker, H. Mathis, in: 2024 Smart Systems Integration Conference and Exhibition (SSI), IEEE, Hamburg, 2024.

DOI

2023

Characterization of Various Environmental Influences on the Inductive Localization

S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, J. Förstner, in: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), IEEE, Genoa, Italy , 2023.

DOI

LoRa-based Swarm Grid Implementation for Rural Electrification in Africa

J.S. Mwakijale, I. Mwammenywa, U. Hilleringmann, in: 2023 IEEE PES/IAS PowerAfrica, IEEE, 2023.

DOI

LoRa Transceiver for Load Monitoring and Control System in Microgrids

I. Mwammenywa, D. Petrov, P. Holle, U. Hilleringmann, in: 2022 International Conference on Engineering and Emerging Technologies (ICEET), IEEE, 2023.

DOI

2022

AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development

J. Maalouly, D. Hemker, C. Hedayat, C. Rückert, I. Kaufmann, M. Olbrich, S. Lange, H. Mathis, in: 2022 Kleinheubach Conference, IEEE, Miltenberg, Germany, 2022.


Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings

S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.

DOI

Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods

T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, H. Kuhn, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.

DOI

Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method

C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, D. Sievers, J. Förstner, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.

DOI

LoRa-based Demand-side Load Monitoring and Management System for Microgrids in Africa

I. Mwammenywa, G.M. Kagarura, D. Petrov, P. Holle, U. Hilleringmann, in: 2021 International Conference on Electrical, Computer and Energy Technologies (ICECET), IEEE, 2022.

DOI

Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods

T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.

DOI

Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings

S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.

DOI

Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings

S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.

DOI

Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings

S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.

DOI

2021

Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses

S. Lange, D. Schröder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, Valencia, Spain , 2021.

DOI

Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction

T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B. Gockel, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, Valencia, Spain , 2021.

DOI

Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field

S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2021.

DOI

Projekt Art-D Grids: Nachhaltige und stabile Microgrids in Afrika - eine Plattform für Forschung und Lehre für die Entwicklung

S. Krauter, J. Böcker, C. Freitag, B. Hehenkamp, U. Hilleringmann, K. Temmen, T. Klaus, N. Rohrer, S. Lehmann, in: Tagungsband des 36. PV-Symposiums, 18.-26 Mai 2021, Conexio, Pforzheim, 2021, pp. 305–309.


Local Power Control using Wireless Sensor System for Microgrids in Africa

U. Hilleringmann, D. Petrov, I. Mwammenywa, G.M. Kagarura, in: IEEE, Arusha, Tansania, 2021.


Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field

S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.

DOI

Low-Cost NB-IoT Microgrid Power Quality Monitoring System

D. Petrov, K. Kroschewski, I. Mwammenywa, G.M. Kagarura, U. Hilleringmann, in: 2021 IEEE Sensors, IEEE, 2021.

DOI

Microcontroller Firmware Design for Industrial Wireless Sensors

D. Petrov, K. Kroschewski, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.

DOI

Influence of electrode metallization on thin-film transistor performance

J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE AFRICON, IEEE, 2021.

DOI

Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction

T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B. Gockel, in: 2021 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021.

DOI

Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses

S. Lange, D. Schroder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021.

DOI

ZnO nanoparticle films as active layer for thin film transistors

U. Hilleringmann, in: Nanostructured Zinc Oxide, Elsevier, 2021.

DOI

Complementary Inverter Circuits on Flexible Substrates

J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.

DOI

Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics

J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), IEEE, 2021.

DOI

A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application

I.R. Kaufmann, O. Zerey, T. Meyers, J. Reker, F. Vidor, U. Hilleringmann, Nanomaterials 11 (2021).

DOI

Complementary Inverter Circuits on Flexible Substrates

J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.

DOI

Local Power Control using Wireless Sensor System for Microgrids in Africa

U. Hilleringmann, D. Petrov, I. Mwammenywa, G.M. Kagarura, in: 2021 IEEE AFRICON, IEEE, 2021.

DOI

The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting

G. Andrews, U. Hilleringmann, T.-H. Joubert, in: 2021 IEEE AFRICON, IEEE, 2021.

DOI

The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting

G. Andrews, U. Hilleringmann, T.-H. Joubert, in: 2021 IEEE AFRICON, IEEE, 2021.

DOI

2020

Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000

S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, U. Hilleringmann, in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, IEEE, 2020.

DOI

Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000

S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, U. Hilleringmann, in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, IEEE, 2020.

DOI

27th European Solid-State Device Research Conference

U. Hilleringmann, in: IEEE, 2020.

DOI

Designing Mixed-Signal PLLs regarding Multiple Requirements taking Non-Ideal Effects into Account

C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), IEEE, 2020.

DOI

Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics

S. Lange, D. Schroder, C. Hedayat, T. Otto, U. Hilleringmann, in: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), IEEE, 2020.

DOI

Water-based primary cell for powering of wireless sensors

D. Petrov, U. Hilleringmann, in: 2020 IEEE SENSORS, IEEE, 2020.

DOI

2019

Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission

S. Lange, M.-J. Büker, D. Sievers, C. Hedayat, J. Förstner, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, VDE VERLAG GMBH, Berlin · Offenbach, 2019, pp. 1–4.


Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics

S. Lange, D. Schröder, C. Hedayat, T. Otto, U. Hilleringmann, in: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), 2019.

DOI

Self-aligned organic thin-film transistors for flexible electronics

T. Meyers, J. Reker, J. Temme, F.F. Vidor, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

DOI

Inorganic p-channel thin-film transistors using CuO nanoparticles

J. Reker, T. Meyers, F.F. Vidor, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

DOI

Nanoparticles and organic semiconductors for flexible electronics

U. Hilleringmann, J. Reker, F.F. Vidor, T. Meyers, T.H. Joubert, P. Bezuidenhout, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

DOI

Improved organic thin-film transistor performance by dielectric layer patterning

J. Temme, T. Meyers, J. Reker, F.F. Vidor, J. Vollbrecht, H. Kitzerow, J. Paradies, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

DOI

Mechanical deformation on nanoparticle-based thin-film transistors

F.F. Vidor, T. Meyers, J. Reker, K. Müller, G.I. Wirth, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

DOI

Oxygen detection with zinc oxide nanoparticle structures

T. Schwabe, A. Balke, P. Bezuidenhout, J. Reker, T. Meyers, T.-H. Joubert, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

DOI

Characterization of inkjet-printed dielectric on different substrates

J. Kruger, P.H. Bezuidenhout, U. Hilleringmann, T.-H. Joubert, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

DOI

Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission

S. Lange, M.-J. Bueker, D. Sievers, C. Hedayat, J. Foerstner, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.


Characterization of H-field Probes regarding Unwanted Field Suppression using Different Calibration Structures

D. Schroeder, C. Hangmann, C. Hedayat, T. Otto, U. Hilleringmann, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.


Wireless power supply for a RFID based sensor platform

M. Schmidt, D. Petrov, C. Hedayat, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.


Characterization of inkjet-printed dielectric on different substrates

J. Kruger, P.H. Bezuidenhout, U. Hilleringmann, T.-H. Joubert, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

DOI

RFID based sensor platform for industry 4.0 application

D. Petrov, M. Schmidt, U. Hilleringmann, C. Hedayat, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.


2018

Silizium-Halbleitertechnologie

U. Hilleringmann, Silizium-Halbleitertechnologie, Springer Fachmedien Wiesbaden, Wiesbaden, 2018.

DOI

Ätztechnik

U. Hilleringmann, in: Silizium-Halbleitertechnologie, Springer Fachmedien Wiesbaden, Wiesbaden, 2018.

DOI

Time domain electrical characterization in zinc oxide nanoparticle thin-film transistors

T.E. Becker, F.F. Vidor, G.I. Wirth, T. Meyers, J. Reker, U. Hilleringmann, in: 2018 IEEE 19th Latin-American Test Symposium (LATS), IEEE, 2018.

DOI

Time domain electrical characterization in zinc oxide nanoparticle thin-film transistors

T.E. Becker, F.F. Vidor, G.I. Wirth, T. Meyers, J. Reker, U. Hilleringmann, in: 2018 IEEE 19th Latin-American Test Symposium (LATS), IEEE, 2018.

DOI

Oxidation des Siliziums

U. Hilleringmann, in: Silizium-Halbleitertechnologie, Springer Fachmedien Wiesbaden, Wiesbaden, 2018.

DOI

Liquid crystalline dithienothiophene derivatives for organic electronics

J. Vollbrecht, P. Oechsle, A. Stepen, F. Hoffmann, J. Paradies, T. Meyers, U. Hilleringmann, J. Schmidtke, H. Kitzerow, Organic Electronics 61 (2018) 266–275.

DOI

2017

Surface Cleaning and Modification by High Intense UV-Irradition for TiO2 Nanoparticle Films in Dye Sensitized Solar Cells

A. Kleine, U. Hilleringmann, Renewable Energy and Power Quality Journal (2017) 102–107.

DOI

Low-voltage C 8 -BTBT thin-film transistors for flexible electronics

T. Meyers, F.F. Vidor, C. Puls, U. Hilleringmann, Materials Today: Proceedings 4 (2017) S232–S236.

DOI

Zinc Oxide Transistors

F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.

DOI

Deposition of ZnO nanoparticles for thin-film transistors by doctor blade process

J. Reker, T. Meyers, F.F. Vidor, U. Hilleringmann, in: 2017 IEEE AFRICON, IEEE, 2017.

DOI

Design and Implementation of a High Temperature Control Monitoring Applied to Micro Thermoelectric Generators

S.C.S. Jucá, P.C.M. Carvalho, R.I.S. Pereira, D. Petrov, U. Hilleringmann, Renewable Energy and Power Quality Journal (2017) 712–717.

DOI

Increasing the Efficiency of Solar Cells by Combining Silicon- and Dye Sensitized Devices

B. Ohms, A. Kleine, U. Hilleringmann, Renewable Energy and Power Quality (2017) 469–473.

DOI

Self-aligned ZnO nanoparticle-based TFTs for flexible electronics

F.F. Vidor, G.I. Wirth, T. Meyers, J. Reker, U. Hilleringmann, in: 2017 IEEE AFRICON, IEEE, 2017.

DOI

Conclusion and Future Perspectives

F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.

DOI

TEGs as self-sufficient power supply for sensors and microelectromechanical systems

M. Schönhoff, U. Hilleringmann, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.

DOI

Complementary field-effect transistors for flexible electronics

U. Hilleringmann, F.F. Vidor, T. Meyers, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.

DOI

Mass production of magnesium silicide as a TEG material

M. Schonhoff, U. Hilleringmann, J. de Boor, in: 2017 IEEE AFRICON, IEEE, 2017.

DOI

ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics

F.F. Vidor, G.I. Wirth, U. Hilleringmann, ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.

DOI

Inverter circuits on freestanding flexible substrate using ZnO nanoparticles for cost-efficient electronics

F.F. Vidor, T. Meyers, K. Müller, G.I. Wirth, U. Hilleringmann, Solid-State Electronics 137 (2017) 16–21.

DOI

Organic Thin-Film Transistors for AMOLED Applications

Th. Meyers, J. Vollbrecht, F. Vidor, J. Reker, H.-S. Kitzerow, U. Hilleringmann, in: IEEE Xplore, MikroSystemTechnik 2017, IEEE, Munich, 2017, pp. 1–4.


Improvements

F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.

DOI

Integration of ZnO nanoparticle transistors on freestanding flexible substrates

F.F. Vidor, T. Meyers, U. Hilleringmann, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.

DOI

Organic Thin-Film Transistors for AMOLED Applications

T. Meyers, J. Vollbrecht, F. Vidor, J. Reker, H.-S. Kitzerow, U. Hilleringmann, in: MikroSystemTechnik 2017; Congress, 2017, pp. 1–4.


2016

Event Driven Modeling and Characterization of the Second Order Voltage Switched Charge Pump PLL

E. Ali, C. Hangmann, C. Hedayat, F. Haddad, W. Rahajandraibe, U. Hilleringmann, IEEE Transactions on Circuits and Systems I: Regular Papers 63 (2016) 347–358.

DOI

Influence of Traps on the Characteristics of ZnO Nanoparticles Thin-Film Transistors

F.F. Vidor, T. Meyers, G.I. Wirth, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–6.


Self-aligning integration technique for organic electronics

T. Meyers, F.F. Vidor, S.F. Kaijage, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–4.


Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics

T. Meyers, F.F. Vidor, K. Brassat, J.K.N. Lindner, U. Hilleringmann, Microelectronic Engineering 174 (2016) 35–39.

DOI

Microstructured Metal Layers in Dye Sensitized Solar Cells

A. Kleine, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–6.


ZnO nanoparticle thin-film transistors on flexible substrate using spray-coating technique

F.F. Vidor, T. Meyers, G.I. Wirth, U. Hilleringmann, Microelectronic Engineering 159 (2016) 155–158.

DOI

Inverter Circuits Using ZnO Nanoparticle Based Thin-Film Transistors for Flexible Electronic Applications

F. Vidor, T. Meyers, U. Hilleringmann, Nanomaterials 6 (2016).

DOI

Organic Field-Effect and Nanoparticle Thin-Film Transistors: Static Model

A. Romero, J. Gonzalez, U. Hilleringmann, P. Gloesekoetter, in: ANALOG 2016; 15. ITG/GMM-Symposium, 2016, pp. 1–6.


Influence of UV irradiation and humidity on a low-cost ZnO nanoparticle TFT for flexible electronics

F.F. Vidor, T. Meyers, U. Hilleringmann, G.I. Wirth, in: 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO), IEEE, 2016.

DOI

Improved rf design using precise 3d near-field measurements and near-field to far-field transformations

C. Hangmann, T. Mager, S. Khan, C. Hedayat, U. Hilleringmann, in: Smart System Integration-International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2016.


High-Q whispering gallery microdisk resonators based on silicon oxynitride

T. Hett, S. Krämmer, U. Hilleringmann, H. Kalt, A. Zrenner, Journal of Luminescence 191 (2016) 131–134.

DOI

2015

Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors

F. Vidor, T. Meyers, U. Hilleringmann, Electronics 4 (2015) 480–506.

DOI

Silicon Nanoparticles contacted by metal nanogaps for FET applications

K. Wolff, U. Hilleringmann, in: 2015.


Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology

U. Hilleringmann, F. Assion, F.F. Vidor, G.I. Wirth, Journal of Machine to Machine Communications 1 (2015) 197–214.

DOI

Application of side-wall deposition and etch-back technology for nanometer scale device integration

U. Hilleringmann, F.F. Vidor, F. Assion, in: Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014), IEEE, 2015.

DOI

Extended event-driven modeling of a ΣΔ-fractional-N PLL including non-ideal effects

C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS), IEEE, 2015.

DOI

Fast and accurate event-driven simulation of a mixed-signal system using the example of a PLL

C. Hangmann, C. Hedayat, U. Hilleringmann, in: Proc. Int. Conf. Exhib. Integr. Issues Miniatured Syst., 2015.


2014

Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics

F.F. Vidor, G.I. Wirth, U. Hilleringmann, Microelectronics Reliability 54 (2014) 2760–2765.

DOI

Stability Analysis of a Charge Pump Phase-Locked Loop Using Autonomous Difference Equations

C. Hangmann, C. Hedayat, U. Hilleringmann, IEEE Transactions on Circuits and Systems I: Regular Papers 61 (2014) 2569–2577.

DOI

Show all publications

Pub­lic­a­tions

2017

Surface Cleaning and Modification by High Intense UV-Irradition for TiO2 Nanoparticle Films in Dye Sensitized Solar Cells

A. Kleine, U. Hilleringmann, Renewable Energy and Power Quality Journal (2017) 102–107.

DOI

Low-voltage C 8 -BTBT thin-film transistors for flexible electronics

T. Meyers, F.F. Vidor, C. Puls, U. Hilleringmann, Materials Today: Proceedings 4 (2017) S232–S236.

DOI

Zinc Oxide Transistors

F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.

DOI

Deposition of ZnO nanoparticles for thin-film transistors by doctor blade process

J. Reker, T. Meyers, F.F. Vidor, U. Hilleringmann, in: 2017 IEEE AFRICON, IEEE, 2017.

DOI

Design and Implementation of a High Temperature Control Monitoring Applied to Micro Thermoelectric Generators

S.C.S. Jucá, P.C.M. Carvalho, R.I.S. Pereira, D. Petrov, U. Hilleringmann, Renewable Energy and Power Quality Journal (2017) 712–717.

DOI

Increasing the Efficiency of Solar Cells by Combining Silicon- and Dye Sensitized Devices

B. Ohms, A. Kleine, U. Hilleringmann, Renewable Energy and Power Quality (2017) 469–473.

DOI

Self-aligned ZnO nanoparticle-based TFTs for flexible electronics

F.F. Vidor, G.I. Wirth, T. Meyers, J. Reker, U. Hilleringmann, in: 2017 IEEE AFRICON, IEEE, 2017.

DOI

Conclusion and Future Perspectives

F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.

DOI

TEGs as self-sufficient power supply for sensors and microelectromechanical systems

M. Schönhoff, U. Hilleringmann, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.

DOI

Complementary field-effect transistors for flexible electronics

U. Hilleringmann, F.F. Vidor, T. Meyers, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.

DOI

Mass production of magnesium silicide as a TEG material

M. Schonhoff, U. Hilleringmann, J. de Boor, in: 2017 IEEE AFRICON, IEEE, 2017.

DOI

ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics

F.F. Vidor, G.I. Wirth, U. Hilleringmann, ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.

DOI

Inverter circuits on freestanding flexible substrate using ZnO nanoparticles for cost-efficient electronics

F.F. Vidor, T. Meyers, K. Müller, G.I. Wirth, U. Hilleringmann, Solid-State Electronics 137 (2017) 16–21.

DOI

Organic Thin-Film Transistors for AMOLED Applications

Th. Meyers, J. Vollbrecht, F. Vidor, J. Reker, H.-S. Kitzerow, U. Hilleringmann, in: IEEE Xplore, MikroSystemTechnik 2017, IEEE, Munich, 2017, pp. 1–4.


Improvements

F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.

DOI

Integration of ZnO nanoparticle transistors on freestanding flexible substrates

F.F. Vidor, T. Meyers, U. Hilleringmann, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.

DOI

Organic Thin-Film Transistors for AMOLED Applications

T. Meyers, J. Vollbrecht, F. Vidor, J. Reker, H.-S. Kitzerow, U. Hilleringmann, in: MikroSystemTechnik 2017; Congress, 2017, pp. 1–4.


2016

Event Driven Modeling and Characterization of the Second Order Voltage Switched Charge Pump PLL

E. Ali, C. Hangmann, C. Hedayat, F. Haddad, W. Rahajandraibe, U. Hilleringmann, IEEE Transactions on Circuits and Systems I: Regular Papers 63 (2016) 347–358.

DOI

Influence of Traps on the Characteristics of ZnO Nanoparticles Thin-Film Transistors

F.F. Vidor, T. Meyers, G.I. Wirth, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–6.


Self-aligning integration technique for organic electronics

T. Meyers, F.F. Vidor, S.F. Kaijage, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–4.


Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics

T. Meyers, F.F. Vidor, K. Brassat, J.K.N. Lindner, U. Hilleringmann, Microelectronic Engineering 174 (2016) 35–39.

DOI

Microstructured Metal Layers in Dye Sensitized Solar Cells

A. Kleine, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–6.


ZnO nanoparticle thin-film transistors on flexible substrate using spray-coating technique

F.F. Vidor, T. Meyers, G.I. Wirth, U. Hilleringmann, Microelectronic Engineering 159 (2016) 155–158.

DOI

Inverter Circuits Using ZnO Nanoparticle Based Thin-Film Transistors for Flexible Electronic Applications

F. Vidor, T. Meyers, U. Hilleringmann, Nanomaterials 6 (2016).

DOI

Organic Field-Effect and Nanoparticle Thin-Film Transistors: Static Model

A. Romero, J. Gonzalez, U. Hilleringmann, P. Gloesekoetter, in: ANALOG 2016; 15. ITG/GMM-Symposium, 2016, pp. 1–6.


Influence of UV irradiation and humidity on a low-cost ZnO nanoparticle TFT for flexible electronics

F.F. Vidor, T. Meyers, U. Hilleringmann, G.I. Wirth, in: 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO), IEEE, 2016.

DOI

Improved rf design using precise 3d near-field measurements and near-field to far-field transformations

C. Hangmann, T. Mager, S. Khan, C. Hedayat, U. Hilleringmann, in: Smart System Integration-International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2016.


High-Q whispering gallery microdisk resonators based on silicon oxynitride

T. Hett, S. Krämmer, U. Hilleringmann, H. Kalt, A. Zrenner, Journal of Luminescence 191 (2016) 131–134.

DOI

2015

Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors

F. Vidor, T. Meyers, U. Hilleringmann, Electronics 4 (2015) 480–506.

DOI

Silicon Nanoparticles contacted by metal nanogaps for FET applications

K. Wolff, U. Hilleringmann, in: 2015.


Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology

U. Hilleringmann, F. Assion, F.F. Vidor, G.I. Wirth, Journal of Machine to Machine Communications 1 (2015) 197–214.

DOI

Application of side-wall deposition and etch-back technology for nanometer scale device integration

U. Hilleringmann, F.F. Vidor, F. Assion, in: Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014), IEEE, 2015.

DOI

Extended event-driven modeling of a ΣΔ-fractional-N PLL including non-ideal effects

C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS), IEEE, 2015.

DOI

Fast and accurate event-driven simulation of a mixed-signal system using the example of a PLL

C. Hangmann, C. Hedayat, U. Hilleringmann, in: Proc. Int. Conf. Exhib. Integr. Issues Miniatured Syst., 2015.


2014

Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics

F.F. Vidor, G.I. Wirth, U. Hilleringmann, Microelectronics Reliability 54 (2014) 2760–2765.

DOI

Stability Analysis of a Charge Pump Phase-Locked Loop Using Autonomous Difference Equations

C. Hangmann, C. Hedayat, U. Hilleringmann, IEEE Transactions on Circuits and Systems I: Regular Papers 61 (2014) 2569–2577.

DOI

Anodized Aluminum as Effective and Cheap Alternative Substrate for Thermoelectric Generators

F. Assion, V. Geneiß, M. Schönhoff, C. Hedayat, U. Hilleringmann, in: A. Amaldi, F. Tang (Eds.), Proceedings of the 11th European Conference on Thermoelectrics, Springer International Publishing, Cham, 2014, pp. 83–88.


A Flexible Measurement System for the Characterization of Thermoelectric Materials

M. Schönhoff, F. Assion, U. Hilleringmann, in: A. Amaldi, F. Tang (Eds.), Proceedings of the 11th European Conference on Thermoelectrics, Springer International Publishing, Cham, 2014, pp. 53–60.


Replacing TCO electrodes in dye sensitized solar cells by metal grids

U. Hilleringmann, A. Kleine, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2014.

DOI

Lithografie

U. Hilleringmann, in: Silizium-Halbleitertechnologie, Springer Fachmedien Wiesbaden, Wiesbaden, 2014.

DOI

Random telegraph signal in nanoparticulated ZnO thin-film transistors

F. Vidor, G. Wirth, U. Hilleringmann, in: The 40th International Conference on Micro and Nano Engineering (MNE2014), 2014.


Embedded UHF RFID tag design process for rubber transmission belt using 3D model

K. Kanwar, T. Mager, U. Hilleringmann, V. Geneiss, C. Hedayat, in: 2014 IEEE RFID Technology and Applications Conference (RFID-TA), IEEE, 2014.

DOI

Modeling and characterization of CP-PLL phase noise in presence of dead zone

C. Hangmann, I. Wullner, C. Hedayat, U. Hilleringmann, in: 2014 IEEE 12th International New Circuits and Systems Conference (NEWCAS), IEEE, 2014.

DOI

Titanium disilicide as hot side metallization layer for thermoelectric generators

U. Hilleringmann, M. Schonhoff, F. Assion, in: 2013 Africon, IEEE, 2014.

DOI

2013

Self-organization of nanospheres in trenches on silicon surfaces

K. Brassat, F. Assion, U. Hilleringmann, J. Lindner, Physica Status Solidi (A) 210 (2013) 1485–1489.

DOI

Self-organization of nanospheres in trenches on silicon surfaces

K. Brassat, F. Assion, U. Hilleringmann, J.K.N. Lindner, Physica Status Solidi (a) 210 (2013) 1485–1489.

DOI

Titanium Disilicide as High-Temperature Contact Material for Thermoelectric Generators

F. Assion, M. Schönhoff, U. Hilleringmann, Journal of Electronic Materials 42 (2013) 1932–1935.

DOI

Enhanced organic light-emitting diode based on a columnar liquid crystal by integration in a microresonator

O. Kasdorf, J. Vollbrecht, B. Ohms, U. Hilleringmann, H. Bock, H.-S. Kitzerow, International Journal of Energy Research 38 (2013) 452–458.

DOI

Design and implementation of a measurement system for automatically measurement of electrical parameters of thermoelectric generators

D. Petrov, F. Assion, U. Hilleringmann, MRS Proceedings 1490 (2013) 191–196.

DOI

Formation and Properties of TiSi<sub>2</sub> as Contact Material for High-Temperature Thermoelectric Generators

F. Assion, M. Schönhoff, U. Hilleringmann, MRS Proceedings 1490 (2013) 97–102.

DOI

Electrical characterization of rubber mixture sheets based on a coaxial probe method in combination with 3D electromagnetic simulation model

K. Kanwar, C. Fischer, V. Geneiss, T. Mager, U. Ballhausen, C. Hedayat, U. Hilleringmann, in: 2012 IEEE International Conference on RFID-Technologies and Applications (RFID-TA), IEEE, 2013.

DOI

Enhanced event-driven modeling of a CP-PLL with nonlinearities and nonidealities

C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2013 IEEE 56th International Midwest Symposium on Circuits and Systems (MWSCAS), IEEE, 2013.

DOI

Resistivity reduction in flexible dye sensitized solar cells by UV irradiation and carbon nanotubes

U. Hilleringmann, B. Ohms, A. Kleine, in: 2013 IEEE International Conference on Industrial Technology (ICIT), IEEE, 2013.

DOI

Characterization and Analysis of the Hysteresis in a ZnO Nanoparticle Thin-Film Transistor

F.F. Vidor, G. Wirth, F. Assion, K. Wolff, U. Hilleringmann, IEEE Transactions on Nanotechnology 12 (2013) 296–303.

DOI

Design and analysis of UHF RFID tag for a rubber transmission belt based on 3D electrical model

K. Kanwar, V. Geneiss, T. Mager, S. Scheele, U. Ballhausen, C. Hedayat, U. Hilleringmann, in: 2013 21st International Conference on Software, Telecommunications and Computer Networks - (SoftCOM 2013), IEEE, 2013.

DOI

Designing output-power-optimized thermoelectric generators via analytic and finite element method modelling

F. Assion, C. Fischer, M. Schonhof, U. Hilleringmann, C. Hedayat, in: 2013 IEEE International Conference on Industrial Technology (ICIT), IEEE, 2013.

DOI

Enhanced organic light-emitting diode based on a columnar liquid crystal by integration in a microresonator

O. Kasdorf, J. Vollbrecht, B. Ohms, U. Hilleringmann, H. Bock, H.-S. Kitzerow, International Journal of Energy Research 38 (2013) 452–458.

DOI

2012

Surface tension and its role for vertical wet etching of silicon

A. Brockmeier, F.J.S. Rodriguez, M. Harrison, U. Hilleringmann, Journal of Micromechanics and Microengineering 22 (2012).

DOI

Surface tension and its role for vertical wet etching of silicon

A. Brockmeier, F.J.S. Rodriguez, M. Harrison, U. Hilleringmann, Journal of Micromechanics and Microengineering 22 (2012).

DOI

Mikrosystemtechnik auf Silizium

U. Hilleringmann, Mikrosystemtechnik Auf Silizium, Vieweg+Teubner Verlag, Wiesbaden, 2012.

DOI

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Pub­lic­a­tions

2011

Study on the Performance Enhancement of ZnO Nanoparticles Thin-Film Transistors

F.F. Vidor, G.I. Wirth, K. Wolff, U. Hilleringmann, ECS Transactions 39 (2011) 109–115.

DOI

Solution processed inverter based on zinc oxide nanoparticle thin-film transistors with poly(4-vinylphenol) gate dielectric

K. Wolff, U. Hilleringmann, Solid-State Electronics 62 (2011) 110–114.

DOI

Characterization of SiON integrated waveguides via FTIR and AFM measurements

T. Frers, T. Hett, U. Hilleringmann, G. Berth, A. Widhalm, A. Zrenner, in: 2011 Semiconductor Conference Dresden, IEEE, 2011.

DOI

Modeling and simulation of arbitrary ordered nonlinear charge-pump phase-locked loops

C. Wiegand, C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2011 Semiconductor Conference Dresden, IEEE, 2011.

DOI

Semiconductor nanoparticles for electronic device integration on foils

U. Hilleringmann, K. Wolff, F. Assion, F.F. Vidor, G.I. Wirth, in: IEEE Africon ’11, IEEE, 2011.

DOI

Plane wave spectrum expansion from near-field measurements on no-planar lattices

C. Reinhold, C. Hangmann, T. Mager, C. Hedayat, U. Hilleringmann, in: Proc. 5th Int. Conf. on Electromagnetic Near-Field Characterization and Imaging (ICONIC) 2011, 2011, pp. 1–4.


Piezoelectric sensor array with evaluation electronic for counting grains in seed drills

S. Meyer zu Hoberge, U. Hilleringmann, C. Jochheim, M. Liebich, in: IEEE Africon ’11, IEEE, 2011.

DOI

2010

Telemetric surface acoustic wave sensor for humidity

M. Dierkes, U. Hilleringmann, Advances in Radio Science 1 (2010) 131–133.

DOI

Non-linear behaviour of charge-pump phase-locked loops

C. Wiegand, C. Hedayat, U. Hilleringmann, Advances in Radio Science 8 (2010) 161–166.

DOI

Organic Field-Effect-Transistors with Pentacene for radio-controlled-price-tag applications

C. Pannemannn, T. Diekmann, U. Hilleringmann, Advances in Radio Science 1 (2010) 219–221.

DOI

Analysis and modeling of pseudo-short-channel effects in ZnO-nanoparticle thin-film transistors

K. Wolff, U. Hilleringmann, in: 2010 Proceedings of the European Solid State Device Research Conference, IEEE, 2010.

DOI

Low-Temperature Integration of Nanoparticulate Zinc Oxide FETs on Glass Substrate

F. Assion, K. Wolff, U. Hilleringmann, in: Proceedings of the European Solid State Device Research Conference (ESSDERC), Seville, Spain, 2010, p. 17.


A Resonance PLL-based Tracking System for Capacitive Sensors-MEMS/NEMS

C. Wiegand, C. Hangmann, C. Hedayat, U. Hilleringmann, Smart System Integration SSI 2010 (2010).


Macro-modelling via radial basis functionen nets

C. Wiegand, C. Fischer, R. Kazemzadeh, C. Hedayat, W. John, U. Hilleringmann, Advances in Radio Science 6 (2010) 139–143.

DOI

2009

Autonomous Sensor Nodes for Aircraft Structural Health Monitoring

T. Becker, M. Kluge, J. Schalk, K. Tiplady, C. Paget, U. Hilleringmann, T. Otterpohl, IEEE Sensors Journal 9 (2009) 1589–1595.

DOI

Efficient Antenna Design of Inductive Coupled RFID-Systems with High Power Demand

C. Reinhold, P. Scholz, W. John, U. Hilleringmann, Journal of Communications 2 (2009).

DOI

N-type single nanoparticle ZnO transistors processed at low temperature

K. Wolff, U. Hilleringmann, in: 2009 Proceedings of the European Solid State Device Research Conference, IEEE, 2009.

DOI

Lock Detection for Charge-Pump Phase-Locked Loops

C. Wiegand, C. Hedayat, U. Hilleringmann, Sophia Antipolis Microelectronics SAME (2009).


2008

Dielectric layers for organic field effect transistors as gate dielectric and surface passivation

T. Diekmann, C. Pannemann, U. Hilleringmann, Physica Status Solidi (a) 205 (2008) 564–577.

DOI

Noise propagation for induced fast transient impulses on PCB-level

M. Taki, W. John, C. Hedayat, U. Hilleringmann, in: 2007 18th International Zurich Symposium on Electromagnetic Compatibility, IEEE, 2008.

DOI

Power management for thermal energy harvesting in aircrafts

Th. Becker, M. Kluge, J. Schalk, T. Otterpohl, U. Hilleringmann, in: 2008 IEEE Sensors, IEEE, 2008.

DOI

Analysis of Energy Transmission for Inductive Coupled RFID Tags

P. Scholz, C. Reinhold, W. John, U. Hilleringmann, in: 2007 IEEE International Conference on RFID, IEEE, 2008.

DOI

2007

Antenna design of HF-RFID tags with high power requirement

P. Scholz, C. Reinhold, W. John, U. Hilleringmann, in: 2007.


Tuning the threshold voltage of organic field-effect transistors by an electret encapsulating layer

M. Scharnberg, V. Zaporojtchenko, R. Adelung, F. Faupel, C. Pannemann, T. Diekmann, U. Hilleringmann, Applied Physics Letters 90 (2007).

DOI

Electro-thermo-mechanical analytical modeling of multilayer cantilever microactuator

J. Jiang, U. Hilleringmann, X. Shui, Sensors and Actuators A: Physical 137 (2007) 302–307.

DOI

Nonlinear Identification of Complex Systems Using Radial Basis Function Networks and Model Order Reduction

C. Wiegand, C. Hedayat, W. John, Lj. Radic-Weissenfeld, U. Hilleringmann, in: 2007 IEEE International Symposium on Electromagnetic Compatibility, IEEE, 2007.

DOI

6I-3 Low-Cost Transceiver Unit for SAW-Sensors Using Customized Hardware Components

P. Scholz, M. Dierkes, U. Hilleringmann, in: 2006 IEEE Ultrasonics Symposium, IEEE, 2007.

DOI

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Pub­lic­a­tions

2006

Encapsulating the active Layer of organic Thin-Film Transistors

C. Pannemann, T. Diekmann, U. Hilleringmann, U. Schurmann, M. Scharnberg, V. Zaporojtchenko, R. Adelung, F. Faupel, in: Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, IEEE, 2006.

DOI

2005

Degradation of organic field-effect transistors made of pentacene

Ch. Pannemann, T. Diekmann, U. Hilleringmann, Journal of Materials Research 19 (2005) 1999–2002.

DOI

On the degradation of organic field-effect transistors

Ch. Pannemann, T. Diekmann, U. Hilleringmann, in: Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004., IEEE, 2005.

DOI

Degradation of organic field-effect transistors made of pentacene

Ch. Pannemann, T. Diekmann, U. Hilleringmann, Journal of Materials Research 19 (2005) 1999–2002.

DOI

Radiotracer measurements as a sensitive tool for the detection of metal penetration in molecular-based organic electronics

M. Scharnberg, J. Hu, J. Kanzow, K. Rätzke, R. Adelung, F. Faupel, C. Pannemann, U. Hilleringmann, S. Meyer, J. Pflaum, Applied Physics Letters 86 (2005).

DOI

Comparison between the charge carrier mobilities in pentacene OFET structures as obtained from electrical characterization and potentiometry

R. Scholz, A.-D. Müller, F. Müller, I. Thurzo, B.A. Paez, L. Mancera, D.R.T. Zahn, C. Pannemann, U. Hilleringmann, in: Z. Bao, D.J. Gundlach (Eds.), SPIE Proceedings, SPIE, 2005.

DOI

Comparison between the charge carrier mobilities in pentacene OFET structures as obtained from electrical characterization and potentiometry

R. Scholz, A.-D. Müller, F. Müller, I. Thurzo, B.A. Paez, L. Mancera, D.R.T. Zahn, C. Pannemann, U. Hilleringmann, in: Z. Bao, D.J. Gundlach (Eds.), SPIE Proceedings, SPIE, 2005.

DOI

2004

Ätztechnik

U. Hilleringmann, in: Silizium-Halbleitertechnologie, Vieweg+Teubner Verlag, Wiesbaden, 2004, pp. 65–90.

DOI

Imprint structured organic thin film transistors as driving circuit in single-use sensor applications

U. Hilleringmann, C. Pannemann, in: G. Zhang, H. Zhao, Z. Wang (Eds.), Fifth International Symposium on Instrumentation and Control Technology, SPIE, 2004.

DOI

Piezoresistive pressure sensors in CVD diamond for high-temperature applications

R. Otterbach, U. Hilleringmann, in: G. Zhang, H. Zhao, Z. Wang (Eds.), Fifth International Symposium on Instrumentation and Control Technology, SPIE, 2004.

DOI

2003

Masking and etching of silicon and related materials for geometries down to 25 nm

U. Hilleringmann, T. Vieregge, J.T. Horstmann, in: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003.

DOI

Matching analysis of NMOS-transistors with a channel length down to 30 nm

J.T. Horstmann, U. Hilleringmann, K. Goser, in: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003.

DOI

Negative differential resistance in ultrashort bulk MOSFETs

G. Wirth, U. Hilleringmann, J.T. Horstmann, K. Goser, in: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003.

DOI

Nanometer scale organic thin film transistors with Pentacene

Ch. Pannemann, T. Diekmann, U. Hilleringmann, Microelectronic Engineering 67–68 (2003) 845–852.

DOI

2002

Optoelectronic system integration on silicon: waveguides, photodetectors, and VLSI CMOS circuits on one chip

U. Hilleringmann, K. Goser, IEEE Transactions on Electron Devices 42 (2002) 841–846.

DOI

Characterization of submicron NMOS devices due to visible light emission

I. Schönstein, J. Müller, U. Hilleringmann, K. Goser, Microelectronic Engineering 21 (2002) 363–366.

DOI

Results of monolithic integration of optical waveguides, photodiodes and CMOS circuits on silicon

U. Hilleringmann, K. Goser, Microelectronic Engineering 19 (2002) 211–214.

DOI

System integration of optical devices and analog CMOS amplifiers

E. Brass, U. Hilleringmann, K. Schumacher, IEEE Journal of Solid-State Circuits 29 (2002) 1006–1010.

DOI

System integration of optical devices and analog CMOS amplifiers

E. Brass, U. Hilleringmann, K. Schumacher, IEEE Journal of Solid-State Circuits 29 (2002) 1006–1010.

DOI

Characterisation of sub-100 nm-MOS-transistors processed by optical lithography and a sidewall-etchback technique

J.T. Horstmann, U. Hilleringmann, K. Goser, Microelectronic Engineering 30 (2002) 431–434.

DOI

VLSI technologies for artificial neural networks

K. Goser, U. Hilleringmann, U. Rueckert, K. Schumacher, IEEE Micro 9 (2002) 28–44.

DOI

A novel insulation technique for smart power switching devices and very high voltage ICs above 10 kV

V. Mankowski, U. Hilleringmann, K. Schumacher, Microelectronic Engineering 53 (2002) 525–528.

DOI

1/f-Noise of sub-100 nm-MOS-transistors fabricated by a special deposition and etchback technique

J.T. Horstmann, U. Hilleringmann, K. Goser, Microelectronic Engineering 53 (2002) 213–216.

DOI

Noise analysis of sub-100 nm-MOS-transistors fabricated by a special deposition and etchback technique

J.T. Horstmann, U. Hilleringmann, K. Goser, in: 2000 26th Annual Conference of the IEEE Industrial Electronics Society. IECON 2000. 2000 IEEE International Conference on Industrial Electronics, Control and Instrumentation. 21st Century Technologies and Industrial Opportunities (Cat. No.00CH37141), IEEE, 2002.

DOI

Noise analysis of sub-100 nm-MOS-transistors fabricated by a special deposition and etchback technique

J.T. Horstmann, U. Hilleringmann, K. Goser, in: 2000 26th Annual Conference of the IEEE Industrial Electronics Society. IECON 2000. 2000 IEEE International Conference on Industrial Electronics, Control and Instrumentation. 21st Century Technologies and Industrial Opportunities (Cat. No.00CH37141), IEEE, 2002.

DOI

A silicon based technology for monolithic integration of waveguides and VLSI CMOS circuits

U. Hilleringmann, K. Knospe, C. Heite, K. Schumacher, K. Goser, Microelectronic Engineering 15 (2002) 289–292.

DOI

VLSI technologies for artificial neural networks

K. Goser, U. Hilleringmann, U. Rueckert, K. Schumacher, IEEE Micro 9 (2002) 28–44.

DOI

Nuclear radiation detectors on various type diamonds

F. Blum, A. Denisenko, R. Job, D. Borchert, W. Weber, J.V. Borany, U. Hilleringmann, W.R. Fahrner, in: IECON ’98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200), IEEE, 2002.

DOI

Floating gate structures as nonvolatile analog memory cells in 1.0μm-LOCOS-CMOS technology with PZT dielectrica

A. Soennecken, U. Hilleringmann, K. Goser, Microelectronic Engineering 15 (2002) 633–636.

DOI

Results of monolithic integration of optical waveguides, photodiodes and CMOS circuits on silicon

U. Hilleringmann, K. Goser, Microelectronic Engineering 19 (2002) 211–214.

DOI

CMOS compatible micromachining by dry silicon-etching techniques

S. Adams, U. Hilleringmann, K. Goser, Microelectronic Engineering 19 (2002) 191–194.

DOI

Matching analysis of deposition defined 50-nm MOSFET's

J.T. Horstmann, U. Hilleringmann, K.F. Goser, IEEE Transactions on Electron Devices 45 (2002) 299–306.

DOI

Applications and implementations of neural networks in microelectronics-overview and status

K. Goser, U. Hilleringmann, U. Rueckert, in: [1991] Proceedings, Advanced Computer Technology, Reliable Systems and Applications, IEEE Comput. Soc. Press, 2002.

DOI

12 kV low current cascaded light triggered switch on one silicon chip

V. Mankowski, U. Hilleringmann, K. Schumacher, Microelectronic Engineering 46 (2002) 413–417.

DOI

Matching analysis of deposition defined 50-nm MOSFET's

J.T. Horstmann, U. Hilleringmann, K.F. Goser, IEEE Transactions on Electron Devices 45 (2002) 299–306.

DOI

Mesoscopic transport phenomena in ultrashort channel MOSFETs

G. Wirth, U. Hilleringmann, J.T. Horstmann, K. Goser, Solid-State Electronics 43 (2002) 1245–1250.

DOI

Structures with a minimum feature size of less than 100 nm in CVD-diamond for sensor applications

R. Otterbach, U. Hilleringmann, T.J. Horstmann, K. Goser, Diamond and Related Materials 10 (2002) 511–514.

DOI

A structure definition technique for 25 nm lines of silicon and related materials

U. Hilleringmann, T. Vieregge, J.T. Horstmann, Microelectronic Engineering 53 (2002) 569–572.

DOI

Reactive ion etching of CVD-diamond for piezoresistive pressure sensors

R. Otterbach, U. Hilleringmann, Diamond and Related Materials 11 (2002) 841–844.

DOI

Metallisierung und Kontakte

U. Hilleringmann, in: Silizium-Halbleitertechnologie, Vieweg+Teubner Verlag, Wiesbaden, 2002, pp. 131–151.

DOI

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Pub­lic­a­tions

2000

Nanometer Scale Lateral Structures of MOS Type Layers

U. Hilleringmann, T. Vieregge, J. Horstmann, in: Proceedings Micro. Tec, 2000, pp. 49–53.


1999

High rate CVD-diamond etching for high temperature pressure sensor applications

R. Otterbach, U. Hilleringmann, in: 29th European Solid-State Device Research Conference, 1999, pp. 320–323.


1998

Correlation Analysis of the Statistical Electrical Parameter Fluctuations in 50 nm MOS-Transistors

J.T. Horstmann, U. Hilleringmann, K. Goser, in: 28th European Solid-State Device Research Conference, 1998, pp. 512–515.


1997

CMOS-compatible organic light-emitting diodes

L.M.H. Heinrich, J. Muller, U. Hilleringmann, K.F. Goser, A. Holmes, D.-H. Hwang, R. Stern, IEEE Transactions on Electron Devices 44 (1997) 1249–1252.

DOI

1996

Analyses of Sub 1/4-Micron MOS-Transistors by Visible Light Emission

J. Muller, G. Wirth, U. Hilleringmann, K. Goser, in: ESSDERC ’96: Proceedings of the 26th European Solid State Device Research Conference, 1996, pp. 947–950.


Characterization and Matching Analysis of 50 nm-NMOS-Transistors

J.T. Horstmann, U. Hilleringmann, K. Goser, in: ESSDERC ’96: Proceedings of the 26th European Solid State Device Research Conference, 1996, pp. 253–256.


ESSDERC’96, Bologna, Italy

J. Horstmann, U. Hilleringmann, K. Goser, in: Conf. Dig, 1996.


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Pub­lic­a­tions

1995

Conjugated Polymers for CMOS Compatible Applications

J. Muller, V. Mankowski, U. Hilleringmann, K. Goser, A. Holmes, O. Gelsen, R. Stern, in: ESSDERC ’95: Proceedings of the 25th European Solid State Device Research Conference, 1995, pp. 659–662.


1994

Micromechanic Pressure Sensors with Optical Readout and CMOS-Amplifiers on Silicon

U. Hilleringmann, S. Adams, K. Goser, in: ESSDERC ’94: 24th European Solid State Device Research Conference, 1994, pp. 387–390.


1993

Monolithic System Integration of Optical Devices, Photodetectors and Analog Transimpedance CMOS Amplifiers

E. Brab, U. Hilleringmann, K. Schumacher, in: ESSCIRC ’93: Nineteenth European Solid-State Circuits Conference, 1993, pp. 242–245.


Hot Carrier Monitoring in NMOS Transistors by Visible Light Emission

I. Schonstein, J. Muller, U. Hilleringmann, K. Goser, in: ESSDERC ’93: 23rd European Solid State Device Research Conference, 1993, pp. 421–424.


Micromechanic pressure sensors with optical readout and CMOS-preamplifiers on one silicon chip: Processing and first results

U. Hilleringmann, S. Adam, K. Goser, in: ESSDtRC’93, 1993.


1992

A Silicon Technology for Monolithic Integration of Optical Waveguides, Photodetectors and VLSI CMOS Circuits

U. Hilleringmann, S. Adams, K. Goser, in: Proceedings ISSSE’92, 1992, pp. 304–307.


Electrooptical coupling of waveguides and VLSI circuits integrated on one silicon chip

S. Adams, U. Hilleringmann, K. Goser, in: EFOC LAN, 1992, pp. 92–92.


1991

Application and implementation of neural networks in microelectronics

K. Goser, U. Hilleringmann, U. Rückert, in: A. Prieto (Ed.), Artificial Neural Networks, Springer Berlin Heidelberg, Berlin, Heidelberg, 1991, pp. 243–259.


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