Veröffentlichte Artikel
Publikationen
2024
G.M. Kagarura, U. Hilleringmann, D. Petrov, in: 2023 IEEE International Conferences on Internet of Things (IThings) and IEEE Green Computing &Amp; Communications (GreenCom) and IEEE Cyber, Physical &Amp; Social Computing (CPSCom) and IEEE Smart Data (SmartData) and IEEE Congress on Cybermatics (Cybermatics), IEEE, 2024.
L.D. Namujju, I. Mwammenywa, G.M. Kagarura, U. Hilleringmann, B. Hehenkamp, in: 2024 IEEE 8th Energy Conference (ENERGYCON), IEEE, 2024.
L.D. Namujju, I. Mwammenywa, G.M. Kagarura, U. Hilleringmann, B. Hehenkamp, in: 2024 IEEE 8th Energy Conference (ENERGYCON), IEEE, 2024.
I.A. Mwammenywa, A Novel Autonomous and Real-Time Load Monitoring and Control System in Microgrids Based on Fuzzy Logic Control and LoRa Wireless Communication, 2024.
2023
S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, J. Förstner, in: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), IEEE, Genoa, Italy , 2023.
J.S. Mwakijale, I. Mwammenywa, U. Hilleringmann, in: 2023 IEEE PES/IAS PowerAfrica, IEEE, 2023.
I. Mwammenywa, D. Petrov, P. Holle, U. Hilleringmann, in: 2022 International Conference on Engineering and Emerging Technologies (ICEET), IEEE, 2023.
2022
J. Maalouly, D. Hemker, C. Hedayat, C. Rückert, I. Kaufmann, M. Olbrich, S. Lange, H. Mathis, in: 2022 Kleinheubach Conference, IEEE, Miltenberg, Germany, 2022.
S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.
T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, H. Kuhn, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.
C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, D. Sievers, J. Förstner, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.
I. Mwammenywa, G.M. Kagarura, D. Petrov, P. Holle, U. Hilleringmann, in: 2021 International Conference on Electrical, Computer and Energy Technologies (ICECET), IEEE, 2022.
T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.
S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.
S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.
S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.
2021
S. Lange, D. Schröder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, Valencia, Spain , 2021.
T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B. Gockel, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, Valencia, Spain , 2021.
S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2021.
S. Krauter, J. Böcker, C. Freitag, B. Hehenkamp, U. Hilleringmann, K. Temmen, T. Klaus, N. Rohrer, S. Lehmann, in: Tagungsband des 36. PV-Symposiums, 18.-26 Mai 2021, Conexio, Pforzheim, 2021, pp. 305–309.
U. Hilleringmann, D. Petrov, I. Mwammenywa, G.M. Kagarura, in: IEEE, Arusha, Tansania, 2021.
S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.
D. Petrov, K. Kroschewski, I. Mwammenywa, G.M. Kagarura, U. Hilleringmann, in: 2021 IEEE Sensors, IEEE, 2021.
D. Petrov, K. Kroschewski, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.
J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE AFRICON, IEEE, 2021.
T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B. Gockel, in: 2021 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021.
S. Lange, D. Schroder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021.
U. Hilleringmann, in: Nanostructured Zinc Oxide, Elsevier, 2021.
J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.
J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), IEEE, 2021.
I.R. Kaufmann, O. Zerey, T. Meyers, J. Reker, F. Vidor, U. Hilleringmann, Nanomaterials 11 (2021).
J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.
U. Hilleringmann, D. Petrov, I. Mwammenywa, G.M. Kagarura, in: 2021 IEEE AFRICON, IEEE, 2021.
G. Andrews, U. Hilleringmann, T.-H. Joubert, in: 2021 IEEE AFRICON, IEEE, 2021.
G. Andrews, U. Hilleringmann, T.-H. Joubert, in: 2021 IEEE AFRICON, IEEE, 2021.
2020
S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, U. Hilleringmann, in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, IEEE, 2020.
S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, U. Hilleringmann, in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, IEEE, 2020.
C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), IEEE, 2020.
S. Lange, D. Schroder, C. Hedayat, T. Otto, U. Hilleringmann, in: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), IEEE, 2020.
D. Petrov, U. Hilleringmann, in: 2020 IEEE SENSORS, IEEE, 2020.
2019
S. Lange, M.-J. Büker, D. Sievers, C. Hedayat, J. Förstner, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, VDE VERLAG GMBH, Berlin · Offenbach, 2019, pp. 1–4.
S. Lange, D. Schröder, C. Hedayat, T. Otto, U. Hilleringmann, in: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), 2019.
T. Meyers, J. Reker, J. Temme, F.F. Vidor, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.
J. Reker, T. Meyers, F.F. Vidor, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.
U. Hilleringmann, J. Reker, F.F. Vidor, T. Meyers, T.H. Joubert, P. Bezuidenhout, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.
J. Temme, T. Meyers, J. Reker, F.F. Vidor, J. Vollbrecht, H. Kitzerow, J. Paradies, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.
F.F. Vidor, T. Meyers, J. Reker, K. Müller, G.I. Wirth, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.
T. Schwabe, A. Balke, P. Bezuidenhout, J. Reker, T. Meyers, T.-H. Joubert, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.
J. Kruger, P.H. Bezuidenhout, U. Hilleringmann, T.-H. Joubert, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.
S. Lange, M.-J. Bueker, D. Sievers, C. Hedayat, J. Foerstner, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.
D. Schroeder, C. Hangmann, C. Hedayat, T. Otto, U. Hilleringmann, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.
M. Schmidt, D. Petrov, C. Hedayat, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.
J. Kruger, P.H. Bezuidenhout, U. Hilleringmann, T.-H. Joubert, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.
D. Petrov, M. Schmidt, U. Hilleringmann, C. Hedayat, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.
2018
U. Hilleringmann, Silizium-Halbleitertechnologie, Springer Fachmedien Wiesbaden, Wiesbaden, 2018.
U. Hilleringmann, in: Silizium-Halbleitertechnologie, Springer Fachmedien Wiesbaden, Wiesbaden, 2018.
T.E. Becker, F.F. Vidor, G.I. Wirth, T. Meyers, J. Reker, U. Hilleringmann, in: 2018 IEEE 19th Latin-American Test Symposium (LATS), IEEE, 2018.
T.E. Becker, F.F. Vidor, G.I. Wirth, T. Meyers, J. Reker, U. Hilleringmann, in: 2018 IEEE 19th Latin-American Test Symposium (LATS), IEEE, 2018.
U. Hilleringmann, in: Silizium-Halbleitertechnologie, Springer Fachmedien Wiesbaden, Wiesbaden, 2018.
J. Vollbrecht, P. Oechsle, A. Stepen, F. Hoffmann, J. Paradies, T. Meyers, U. Hilleringmann, J. Schmidtke, H. Kitzerow, Organic Electronics 61 (2018) 266–275.
2017
A. Kleine, U. Hilleringmann, Renewable Energy and Power Quality Journal (2017) 102–107.
T. Meyers, F.F. Vidor, C. Puls, U. Hilleringmann, Materials Today: Proceedings 4 (2017) S232–S236.
F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.
J. Reker, T. Meyers, F.F. Vidor, U. Hilleringmann, in: 2017 IEEE AFRICON, IEEE, 2017.
S.C.S. Jucá, P.C.M. Carvalho, R.I.S. Pereira, D. Petrov, U. Hilleringmann, Renewable Energy and Power Quality Journal (2017) 712–717.
B. Ohms, A. Kleine, U. Hilleringmann, Renewable Energy and Power Quality (2017) 469–473.
F.F. Vidor, G.I. Wirth, T. Meyers, J. Reker, U. Hilleringmann, in: 2017 IEEE AFRICON, IEEE, 2017.
F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.
M. Schönhoff, U. Hilleringmann, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.
U. Hilleringmann, F.F. Vidor, T. Meyers, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.
M. Schonhoff, U. Hilleringmann, J. de Boor, in: 2017 IEEE AFRICON, IEEE, 2017.
F.F. Vidor, G.I. Wirth, U. Hilleringmann, ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.
F.F. Vidor, T. Meyers, K. Müller, G.I. Wirth, U. Hilleringmann, Solid-State Electronics 137 (2017) 16–21.
Th. Meyers, J. Vollbrecht, F. Vidor, J. Reker, H.-S. Kitzerow, U. Hilleringmann, in: IEEE Xplore, MikroSystemTechnik 2017, IEEE, Munich, 2017, pp. 1–4.
F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.
F.F. Vidor, T. Meyers, U. Hilleringmann, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.
T. Meyers, J. Vollbrecht, F. Vidor, J. Reker, H.-S. Kitzerow, U. Hilleringmann, in: MikroSystemTechnik 2017; Congress, 2017, pp. 1–4.
2016
E. Ali, C. Hangmann, C. Hedayat, F. Haddad, W. Rahajandraibe, U. Hilleringmann, IEEE Transactions on Circuits and Systems I: Regular Papers 63 (2016) 347–358.
F.F. Vidor, T. Meyers, G.I. Wirth, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–6.
T. Meyers, F.F. Vidor, S.F. Kaijage, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–4.
T. Meyers, F.F. Vidor, K. Brassat, J.K.N. Lindner, U. Hilleringmann, Microelectronic Engineering 174 (2016) 35–39.
A. Kleine, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–6.
F.F. Vidor, T. Meyers, G.I. Wirth, U. Hilleringmann, Microelectronic Engineering 159 (2016) 155–158.
F. Vidor, T. Meyers, U. Hilleringmann, Nanomaterials 6 (2016).
A. Romero, J. Gonzalez, U. Hilleringmann, P. Gloesekoetter, in: ANALOG 2016; 15. ITG/GMM-Symposium, 2016, pp. 1–6.
F.F. Vidor, T. Meyers, U. Hilleringmann, G.I. Wirth, in: 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO), IEEE, 2016.
C. Hangmann, T. Mager, S. Khan, C. Hedayat, U. Hilleringmann, in: Smart System Integration-International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2016.
T. Hett, S. Krämmer, U. Hilleringmann, H. Kalt, A. Zrenner, Journal of Luminescence 191 (2016) 131–134.
2015
F. Vidor, T. Meyers, U. Hilleringmann, Electronics 4 (2015) 480–506.
K. Wolff, U. Hilleringmann, in: 2015.
U. Hilleringmann, F. Assion, F.F. Vidor, G.I. Wirth, Journal of Machine to Machine Communications 1 (2015) 197–214.
U. Hilleringmann, F.F. Vidor, F. Assion, in: Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014), IEEE, 2015.
C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS), IEEE, 2015.
C. Hangmann, C. Hedayat, U. Hilleringmann, in: Proc. Int. Conf. Exhib. Integr. Issues Miniatured Syst., 2015.
2014
F.F. Vidor, G.I. Wirth, U. Hilleringmann, Microelectronics Reliability 54 (2014) 2760–2765.
C. Hangmann, C. Hedayat, U. Hilleringmann, IEEE Transactions on Circuits and Systems I: Regular Papers 61 (2014) 2569–2577.
F. Assion, V. Geneiß, M. Schönhoff, C. Hedayat, U. Hilleringmann, in: A. Amaldi, F. Tang (Eds.), Proceedings of the 11th European Conference on Thermoelectrics, Springer International Publishing, Cham, 2014, pp. 83–88.
M. Schönhoff, F. Assion, U. Hilleringmann, in: A. Amaldi, F. Tang (Eds.), Proceedings of the 11th European Conference on Thermoelectrics, Springer International Publishing, Cham, 2014, pp. 53–60.
U. Hilleringmann, A. Kleine, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2014.
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Publikationen
2017
A. Kleine, U. Hilleringmann, Renewable Energy and Power Quality Journal (2017) 102–107.
T. Meyers, F.F. Vidor, C. Puls, U. Hilleringmann, Materials Today: Proceedings 4 (2017) S232–S236.
F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.
J. Reker, T. Meyers, F.F. Vidor, U. Hilleringmann, in: 2017 IEEE AFRICON, IEEE, 2017.
S.C.S. Jucá, P.C.M. Carvalho, R.I.S. Pereira, D. Petrov, U. Hilleringmann, Renewable Energy and Power Quality Journal (2017) 712–717.
B. Ohms, A. Kleine, U. Hilleringmann, Renewable Energy and Power Quality (2017) 469–473.
F.F. Vidor, G.I. Wirth, T. Meyers, J. Reker, U. Hilleringmann, in: 2017 IEEE AFRICON, IEEE, 2017.
F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.
M. Schönhoff, U. Hilleringmann, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.
U. Hilleringmann, F.F. Vidor, T. Meyers, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.
M. Schonhoff, U. Hilleringmann, J. de Boor, in: 2017 IEEE AFRICON, IEEE, 2017.
F.F. Vidor, G.I. Wirth, U. Hilleringmann, ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.
F.F. Vidor, T. Meyers, K. Müller, G.I. Wirth, U. Hilleringmann, Solid-State Electronics 137 (2017) 16–21.
Th. Meyers, J. Vollbrecht, F. Vidor, J. Reker, H.-S. Kitzerow, U. Hilleringmann, in: IEEE Xplore, MikroSystemTechnik 2017, IEEE, Munich, 2017, pp. 1–4.
F.F. Vidor, G.I. Wirth, U. Hilleringmann, in: ZnO Thin-Film Transistors for Cost-Efficient Flexible Electronics, Springer International Publishing, Cham, 2017.
F.F. Vidor, T. Meyers, U. Hilleringmann, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2017.
T. Meyers, J. Vollbrecht, F. Vidor, J. Reker, H.-S. Kitzerow, U. Hilleringmann, in: MikroSystemTechnik 2017; Congress, 2017, pp. 1–4.
2016
E. Ali, C. Hangmann, C. Hedayat, F. Haddad, W. Rahajandraibe, U. Hilleringmann, IEEE Transactions on Circuits and Systems I: Regular Papers 63 (2016) 347–358.
F.F. Vidor, T. Meyers, G.I. Wirth, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–6.
T. Meyers, F.F. Vidor, S.F. Kaijage, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–4.
T. Meyers, F.F. Vidor, K. Brassat, J.K.N. Lindner, U. Hilleringmann, Microelectronic Engineering 174 (2016) 35–39.
A. Kleine, U. Hilleringmann, in: Micro-Nano-Integration; 6. GMM-Workshop, 2016, pp. 1–6.
F.F. Vidor, T. Meyers, G.I. Wirth, U. Hilleringmann, Microelectronic Engineering 159 (2016) 155–158.
F. Vidor, T. Meyers, U. Hilleringmann, Nanomaterials 6 (2016).
A. Romero, J. Gonzalez, U. Hilleringmann, P. Gloesekoetter, in: ANALOG 2016; 15. ITG/GMM-Symposium, 2016, pp. 1–6.
F.F. Vidor, T. Meyers, U. Hilleringmann, G.I. Wirth, in: 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO), IEEE, 2016.
C. Hangmann, T. Mager, S. Khan, C. Hedayat, U. Hilleringmann, in: Smart System Integration-International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2016.
T. Hett, S. Krämmer, U. Hilleringmann, H. Kalt, A. Zrenner, Journal of Luminescence 191 (2016) 131–134.
2015
F. Vidor, T. Meyers, U. Hilleringmann, Electronics 4 (2015) 480–506.
K. Wolff, U. Hilleringmann, in: 2015.
U. Hilleringmann, F. Assion, F.F. Vidor, G.I. Wirth, Journal of Machine to Machine Communications 1 (2015) 197–214.
U. Hilleringmann, F.F. Vidor, F. Assion, in: Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014), IEEE, 2015.
C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS), IEEE, 2015.
C. Hangmann, C. Hedayat, U. Hilleringmann, in: Proc. Int. Conf. Exhib. Integr. Issues Miniatured Syst., 2015.
2014
F.F. Vidor, G.I. Wirth, U. Hilleringmann, Microelectronics Reliability 54 (2014) 2760–2765.
C. Hangmann, C. Hedayat, U. Hilleringmann, IEEE Transactions on Circuits and Systems I: Regular Papers 61 (2014) 2569–2577.
F. Assion, V. Geneiß, M. Schönhoff, C. Hedayat, U. Hilleringmann, in: A. Amaldi, F. Tang (Eds.), Proceedings of the 11th European Conference on Thermoelectrics, Springer International Publishing, Cham, 2014, pp. 83–88.
M. Schönhoff, F. Assion, U. Hilleringmann, in: A. Amaldi, F. Tang (Eds.), Proceedings of the 11th European Conference on Thermoelectrics, Springer International Publishing, Cham, 2014, pp. 53–60.
U. Hilleringmann, A. Kleine, in: M. du Plessis (Ed.), SPIE Proceedings, SPIE, 2014.
U. Hilleringmann, in: Silizium-Halbleitertechnologie, Springer Fachmedien Wiesbaden, Wiesbaden, 2014.
F. Vidor, G. Wirth, U. Hilleringmann, in: The 40th International Conference on Micro and Nano Engineering (MNE2014), 2014.
K. Kanwar, T. Mager, U. Hilleringmann, V. Geneiss, C. Hedayat, in: 2014 IEEE RFID Technology and Applications Conference (RFID-TA), IEEE, 2014.
C. Hangmann, I. Wullner, C. Hedayat, U. Hilleringmann, in: 2014 IEEE 12th International New Circuits and Systems Conference (NEWCAS), IEEE, 2014.
U. Hilleringmann, M. Schonhoff, F. Assion, in: 2013 Africon, IEEE, 2014.
2013
K. Brassat, F. Assion, U. Hilleringmann, J. Lindner, Physica Status Solidi (A) 210 (2013) 1485–1489.
K. Brassat, F. Assion, U. Hilleringmann, J.K.N. Lindner, Physica Status Solidi (a) 210 (2013) 1485–1489.
F. Assion, M. Schönhoff, U. Hilleringmann, Journal of Electronic Materials 42 (2013) 1932–1935.
O. Kasdorf, J. Vollbrecht, B. Ohms, U. Hilleringmann, H. Bock, H.-S. Kitzerow, International Journal of Energy Research 38 (2013) 452–458.
D. Petrov, F. Assion, U. Hilleringmann, MRS Proceedings 1490 (2013) 191–196.
F. Assion, M. Schönhoff, U. Hilleringmann, MRS Proceedings 1490 (2013) 97–102.
K. Kanwar, C. Fischer, V. Geneiss, T. Mager, U. Ballhausen, C. Hedayat, U. Hilleringmann, in: 2012 IEEE International Conference on RFID-Technologies and Applications (RFID-TA), IEEE, 2013.
C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2013 IEEE 56th International Midwest Symposium on Circuits and Systems (MWSCAS), IEEE, 2013.
U. Hilleringmann, B. Ohms, A. Kleine, in: 2013 IEEE International Conference on Industrial Technology (ICIT), IEEE, 2013.
F.F. Vidor, G. Wirth, F. Assion, K. Wolff, U. Hilleringmann, IEEE Transactions on Nanotechnology 12 (2013) 296–303.
K. Kanwar, V. Geneiss, T. Mager, S. Scheele, U. Ballhausen, C. Hedayat, U. Hilleringmann, in: 2013 21st International Conference on Software, Telecommunications and Computer Networks - (SoftCOM 2013), IEEE, 2013.
F. Assion, C. Fischer, M. Schonhof, U. Hilleringmann, C. Hedayat, in: 2013 IEEE International Conference on Industrial Technology (ICIT), IEEE, 2013.
O. Kasdorf, J. Vollbrecht, B. Ohms, U. Hilleringmann, H. Bock, H.-S. Kitzerow, International Journal of Energy Research 38 (2013) 452–458.
2012
A. Brockmeier, F.J.S. Rodriguez, M. Harrison, U. Hilleringmann, Journal of Micromechanics and Microengineering 22 (2012).
A. Brockmeier, F.J.S. Rodriguez, M. Harrison, U. Hilleringmann, Journal of Micromechanics and Microengineering 22 (2012).
U. Hilleringmann, Mikrosystemtechnik Auf Silizium, Vieweg+Teubner Verlag, Wiesbaden, 2012.
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Publikationen
2011
F.F. Vidor, G.I. Wirth, K. Wolff, U. Hilleringmann, ECS Transactions 39 (2011) 109–115.
K. Wolff, U. Hilleringmann, Solid-State Electronics 62 (2011) 110–114.
T. Frers, T. Hett, U. Hilleringmann, G. Berth, A. Widhalm, A. Zrenner, in: 2011 Semiconductor Conference Dresden, IEEE, 2011.
C. Wiegand, C. Hangmann, C. Hedayat, U. Hilleringmann, in: 2011 Semiconductor Conference Dresden, IEEE, 2011.
U. Hilleringmann, K. Wolff, F. Assion, F.F. Vidor, G.I. Wirth, in: IEEE Africon ’11, IEEE, 2011.
C. Reinhold, C. Hangmann, T. Mager, C. Hedayat, U. Hilleringmann, in: Proc. 5th Int. Conf. on Electromagnetic Near-Field Characterization and Imaging (ICONIC) 2011, 2011, pp. 1–4.
S. Meyer zu Hoberge, U. Hilleringmann, C. Jochheim, M. Liebich, in: IEEE Africon ’11, IEEE, 2011.
2010
M. Dierkes, U. Hilleringmann, Advances in Radio Science 1 (2010) 131–133.
C. Wiegand, C. Hedayat, U. Hilleringmann, Advances in Radio Science 8 (2010) 161–166.
C. Pannemannn, T. Diekmann, U. Hilleringmann, Advances in Radio Science 1 (2010) 219–221.
K. Wolff, U. Hilleringmann, in: 2010 Proceedings of the European Solid State Device Research Conference, IEEE, 2010.
F. Assion, K. Wolff, U. Hilleringmann, in: Proceedings of the European Solid State Device Research Conference (ESSDERC), Seville, Spain, 2010, p. 17.
C. Wiegand, C. Hangmann, C. Hedayat, U. Hilleringmann, Smart System Integration SSI 2010 (2010).
C. Wiegand, C. Fischer, R. Kazemzadeh, C. Hedayat, W. John, U. Hilleringmann, Advances in Radio Science 6 (2010) 139–143.
2009
T. Becker, M. Kluge, J. Schalk, K. Tiplady, C. Paget, U. Hilleringmann, T. Otterpohl, IEEE Sensors Journal 9 (2009) 1589–1595.
C. Reinhold, P. Scholz, W. John, U. Hilleringmann, Journal of Communications 2 (2009).
K. Wolff, U. Hilleringmann, in: 2009 Proceedings of the European Solid State Device Research Conference, IEEE, 2009.
C. Wiegand, C. Hedayat, U. Hilleringmann, Sophia Antipolis Microelectronics SAME (2009).
2008
T. Diekmann, C. Pannemann, U. Hilleringmann, Physica Status Solidi (a) 205 (2008) 564–577.
M. Taki, W. John, C. Hedayat, U. Hilleringmann, in: 2007 18th International Zurich Symposium on Electromagnetic Compatibility, IEEE, 2008.
Th. Becker, M. Kluge, J. Schalk, T. Otterpohl, U. Hilleringmann, in: 2008 IEEE Sensors, IEEE, 2008.
P. Scholz, C. Reinhold, W. John, U. Hilleringmann, in: 2007 IEEE International Conference on RFID, IEEE, 2008.
2007
P. Scholz, C. Reinhold, W. John, U. Hilleringmann, in: 2007.
M. Scharnberg, V. Zaporojtchenko, R. Adelung, F. Faupel, C. Pannemann, T. Diekmann, U. Hilleringmann, Applied Physics Letters 90 (2007).
J. Jiang, U. Hilleringmann, X. Shui, Sensors and Actuators A: Physical 137 (2007) 302–307.
C. Wiegand, C. Hedayat, W. John, Lj. Radic-Weissenfeld, U. Hilleringmann, in: 2007 IEEE International Symposium on Electromagnetic Compatibility, IEEE, 2007.
P. Scholz, M. Dierkes, U. Hilleringmann, in: 2006 IEEE Ultrasonics Symposium, IEEE, 2007.
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2006
C. Pannemann, T. Diekmann, U. Hilleringmann, U. Schurmann, M. Scharnberg, V. Zaporojtchenko, R. Adelung, F. Faupel, in: Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, IEEE, 2006.
2005
Ch. Pannemann, T. Diekmann, U. Hilleringmann, Journal of Materials Research 19 (2005) 1999–2002.
Ch. Pannemann, T. Diekmann, U. Hilleringmann, in: Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004., IEEE, 2005.
Ch. Pannemann, T. Diekmann, U. Hilleringmann, Journal of Materials Research 19 (2005) 1999–2002.
M. Scharnberg, J. Hu, J. Kanzow, K. Rätzke, R. Adelung, F. Faupel, C. Pannemann, U. Hilleringmann, S. Meyer, J. Pflaum, Applied Physics Letters 86 (2005).
R. Scholz, A.-D. Müller, F. Müller, I. Thurzo, B.A. Paez, L. Mancera, D.R.T. Zahn, C. Pannemann, U. Hilleringmann, in: Z. Bao, D.J. Gundlach (Eds.), SPIE Proceedings, SPIE, 2005.
R. Scholz, A.-D. Müller, F. Müller, I. Thurzo, B.A. Paez, L. Mancera, D.R.T. Zahn, C. Pannemann, U. Hilleringmann, in: Z. Bao, D.J. Gundlach (Eds.), SPIE Proceedings, SPIE, 2005.
2004
U. Hilleringmann, in: Silizium-Halbleitertechnologie, Vieweg+Teubner Verlag, Wiesbaden, 2004, pp. 65–90.
U. Hilleringmann, C. Pannemann, in: G. Zhang, H. Zhao, Z. Wang (Eds.), Fifth International Symposium on Instrumentation and Control Technology, SPIE, 2004.
R. Otterbach, U. Hilleringmann, in: G. Zhang, H. Zhao, Z. Wang (Eds.), Fifth International Symposium on Instrumentation and Control Technology, SPIE, 2004.
2003
U. Hilleringmann, T. Vieregge, J.T. Horstmann, in: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003.
J.T. Horstmann, U. Hilleringmann, K. Goser, in: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003.
G. Wirth, U. Hilleringmann, J.T. Horstmann, K. Goser, in: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003.
Ch. Pannemann, T. Diekmann, U. Hilleringmann, Microelectronic Engineering 67–68 (2003) 845–852.
2002
U. Hilleringmann, K. Goser, IEEE Transactions on Electron Devices 42 (2002) 841–846.
I. Schönstein, J. Müller, U. Hilleringmann, K. Goser, Microelectronic Engineering 21 (2002) 363–366.
U. Hilleringmann, K. Goser, Microelectronic Engineering 19 (2002) 211–214.
E. Brass, U. Hilleringmann, K. Schumacher, IEEE Journal of Solid-State Circuits 29 (2002) 1006–1010.
E. Brass, U. Hilleringmann, K. Schumacher, IEEE Journal of Solid-State Circuits 29 (2002) 1006–1010.
J.T. Horstmann, U. Hilleringmann, K. Goser, Microelectronic Engineering 30 (2002) 431–434.
K. Goser, U. Hilleringmann, U. Rueckert, K. Schumacher, IEEE Micro 9 (2002) 28–44.
V. Mankowski, U. Hilleringmann, K. Schumacher, Microelectronic Engineering 53 (2002) 525–528.
J.T. Horstmann, U. Hilleringmann, K. Goser, Microelectronic Engineering 53 (2002) 213–216.
J.T. Horstmann, U. Hilleringmann, K. Goser, in: 2000 26th Annual Conference of the IEEE Industrial Electronics Society. IECON 2000. 2000 IEEE International Conference on Industrial Electronics, Control and Instrumentation. 21st Century Technologies and Industrial Opportunities (Cat. No.00CH37141), IEEE, 2002.
J.T. Horstmann, U. Hilleringmann, K. Goser, in: 2000 26th Annual Conference of the IEEE Industrial Electronics Society. IECON 2000. 2000 IEEE International Conference on Industrial Electronics, Control and Instrumentation. 21st Century Technologies and Industrial Opportunities (Cat. No.00CH37141), IEEE, 2002.
U. Hilleringmann, K. Knospe, C. Heite, K. Schumacher, K. Goser, Microelectronic Engineering 15 (2002) 289–292.
K. Goser, U. Hilleringmann, U. Rueckert, K. Schumacher, IEEE Micro 9 (2002) 28–44.
F. Blum, A. Denisenko, R. Job, D. Borchert, W. Weber, J.V. Borany, U. Hilleringmann, W.R. Fahrner, in: IECON ’98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200), IEEE, 2002.
A. Soennecken, U. Hilleringmann, K. Goser, Microelectronic Engineering 15 (2002) 633–636.
U. Hilleringmann, K. Goser, Microelectronic Engineering 19 (2002) 211–214.
S. Adams, U. Hilleringmann, K. Goser, Microelectronic Engineering 19 (2002) 191–194.
J.T. Horstmann, U. Hilleringmann, K.F. Goser, IEEE Transactions on Electron Devices 45 (2002) 299–306.
K. Goser, U. Hilleringmann, U. Rueckert, in: [1991] Proceedings, Advanced Computer Technology, Reliable Systems and Applications, IEEE Comput. Soc. Press, 2002.
V. Mankowski, U. Hilleringmann, K. Schumacher, Microelectronic Engineering 46 (2002) 413–417.
J.T. Horstmann, U. Hilleringmann, K.F. Goser, IEEE Transactions on Electron Devices 45 (2002) 299–306.
G. Wirth, U. Hilleringmann, J.T. Horstmann, K. Goser, Solid-State Electronics 43 (2002) 1245–1250.
R. Otterbach, U. Hilleringmann, T.J. Horstmann, K. Goser, Diamond and Related Materials 10 (2002) 511–514.
U. Hilleringmann, T. Vieregge, J.T. Horstmann, Microelectronic Engineering 53 (2002) 569–572.
R. Otterbach, U. Hilleringmann, Diamond and Related Materials 11 (2002) 841–844.
U. Hilleringmann, in: Silizium-Halbleitertechnologie, Vieweg+Teubner Verlag, Wiesbaden, 2002, pp. 131–151.
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2000
U. Hilleringmann, T. Vieregge, J. Horstmann, in: Proceedings Micro. Tec, 2000, pp. 49–53.
1999
R. Otterbach, U. Hilleringmann, in: 29th European Solid-State Device Research Conference, 1999, pp. 320–323.
1998
J.T. Horstmann, U. Hilleringmann, K. Goser, in: 28th European Solid-State Device Research Conference, 1998, pp. 512–515.
1997
L.M.H. Heinrich, J. Muller, U. Hilleringmann, K.F. Goser, A. Holmes, D.-H. Hwang, R. Stern, IEEE Transactions on Electron Devices 44 (1997) 1249–1252.
1996
J. Muller, G. Wirth, U. Hilleringmann, K. Goser, in: ESSDERC ’96: Proceedings of the 26th European Solid State Device Research Conference, 1996, pp. 947–950.
J.T. Horstmann, U. Hilleringmann, K. Goser, in: ESSDERC ’96: Proceedings of the 26th European Solid State Device Research Conference, 1996, pp. 253–256.
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1995
J. Muller, V. Mankowski, U. Hilleringmann, K. Goser, A. Holmes, O. Gelsen, R. Stern, in: ESSDERC ’95: Proceedings of the 25th European Solid State Device Research Conference, 1995, pp. 659–662.
1994
U. Hilleringmann, S. Adams, K. Goser, in: ESSDERC ’94: 24th European Solid State Device Research Conference, 1994, pp. 387–390.
1993
E. Brab, U. Hilleringmann, K. Schumacher, in: ESSCIRC ’93: Nineteenth European Solid-State Circuits Conference, 1993, pp. 242–245.
I. Schonstein, J. Muller, U. Hilleringmann, K. Goser, in: ESSDERC ’93: 23rd European Solid State Device Research Conference, 1993, pp. 421–424.
U. Hilleringmann, S. Adam, K. Goser, in: ESSDtRC’93, 1993.
1992
U. Hilleringmann, S. Adams, K. Goser, in: Proceedings ISSSE’92, 1992, pp. 304–307.
S. Adams, U. Hilleringmann, K. Goser, in: EFOC LAN, 1992, pp. 92–92.
1991
K. Goser, U. Hilleringmann, U. Rückert, in: A. Prieto (Ed.), Artificial Neural Networks, Springer Berlin Heidelberg, Berlin, Heidelberg, 1991, pp. 243–259.
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